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New Materials(Materials) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

New Materials Product List

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New material "FRP"

We have various equipment, including RTM equipment and REWORK equipment!

"FRP" stands for Fiber Reinforced Plastics, or in other words, it is a composite material made of fibers and resin. Our company currently has a PILOT LINE for FRP and is dedicated to its development. We have a track record of using GFRP panels in products such as the "Fujitsu Tablet (10-inch) arrows Tab (F-04H) Rear case" and the "Panasonic Tablet (20-inch) TOUGHPAD 4K Rear case." 【Equipment Owned】 ■ RTM Equipment ■ REWORK Equipment ■ Epoxy Injector ■ CNC and Dust Collector *For more details, please refer to the PDF document or feel free to contact us.

  • Composite Materials
  • New Materials

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New materials of graphite-based metal matrix composites ACM-H1/ACM-H2

Ideal as a substitute for aluminum, copper, and AlSic (heat spreader).

It is a new material with a balanced set of properties, featuring thermal conductivity second only to diamond, higher than copper, and a thermal expansion that is as small as that of ceramics, with a specific gravity of less than one-fourth that of copper.

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New material ACM-H3 of graphite-based metal matrix composite.

High rigidity heat dissipation structural members (sub-heat spreaders, heat spreaders, heat sinks, etc.)

A new material that compensates for the shortcomings of aluminum and copper: lighter than copper, stronger than aluminum, with a thermal expansion rate comparable to titanium, and a well-balanced thermal conductivity.

  • Other metal materials
  • New Materials

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New material ACM-H4/5 of graphite-based metal matrix composites

A new material with a characteristic balance not found in conventional materials: high thermal conductivity comparable to ceramics/aluminum substrates and low thermal expansion similar to ceramics.

● A new material that has never existed before: a composite of aluminum and graphite ● A new material with a characteristic balance not found in conventional materials: high thermal conductivity comparable to ceramics/aluminum substrates and low thermal expansion similar to ceramics ● A new material with expanded applications beyond heat dissipation components: high strength and high Young's modulus ● A new material with excellent machinability: can be processed with standard machining tools

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